IEC 61967-1:2002 pdf download

IEC 61967-1:2002 pdf download.lntegrated circuits – Measurement of electromagneticemissions, 150 kHz to 1 GHzPart 1: General conditions and definitions.
For the purpose of this part of IEC 61967, the following definitions, taken mostly from IEC 60050(161), apply.
3.1
artificial network
AN
agreed reference load impedance (simulated), presented to the EUT by networks (for example, extended power or communication lines) across which the RF disturbance voltage is measured and which isolates the apparatus from the power supply or loads in that frequency range
[1EV 161-04-05, modified]
3.2
associated equipment
transducers (for example, probes, networks and antennas) connected to a measuring receiver or test generator; also transducers (for example, probes, networks, and antennas) which are used in the signal or disturbance transmission path between an EUT and measuring equipment or a (test-) signal generator
3.3
auto sweep
fastest calibrated sweep which a spectrum analyser will automatically select based on start frequency, stop frequency, resolution bandwidth and video bandwidth
3.4
broadband emission
emission which has a bandwidth greater than that of a particular measuring apparatus or receiver
[1EV 161-06-11, modified]
3.5
common mode voltage asymmetrical voltage
mean of the phasor voltages appearing between each conductor and a specified reference, usually earth or frame
[1EV 161-04-09]
3.6
common mode current
in a cable having more than one conductor, including shields and screens, if any, the magnitude of the sum of the phasors representing the currents in each conductor
[1EV 161-04-39]
3.7
conducted emissions
transients and/or other disturbances observed on the external terminals of a device during its normal operation
3.8
continuous disturbance
RF disturbance with a duration of more than 200 ms at the IF-output of a measuring receiver, which causes a deflection on the meter of a measuring receiver in quasi-peak detection mode which does not decrease immediately
[1EV 161-02-11, modified]
DUT
device, equipment or system being evaluated
NOTE As used in this standard, D(JT refers to a semiconductor device being tested.
3.10
die shrink
amount of shrink of the mask used to produce the integrated circuit (IC) expressed as a
percentage or dimensions relative to the original artwork layout (drawn size)
3.11
differential mode current
in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the magnitude of the difference of the phasors representing the currents in each conductor
[1EV 161-04-38]
3.12
differential mode voltage
voltage between any two of a specified set of active conductors
[1EV 161-04-08]
3.13
discontinuous disturbance
for counted clicks, disturbance with a duration of less than 200 ms at the IF-output of a measuring receiver, which causes a transient deflection on the meter of a measuring receiver in quasi-peak detection mode
[1EV 161-02-28, modified]
3.14
electrically small PCB
printed circuit board, whose dimension is smaller than J2, for example, 100 mm to 150 mm ati GHz
3.15
electromagnetic compatibility
EMC
ability of an equipment or system to function satisfactorily in its electromagnetic environment without introducing intolerable electromagnetic disturbances to anything in that environment
[1EV 161-01-07]
3.16
electromagnetic emission
phenomenon by which electromagnetic energy emanates from a source
3.17
electromagnetic radiation radiated emissions
1. phenomena by which energy in the form of electromagnetic waves emanates from a source into space
2. energy transferred through space in the form of electromagnetic waves
[1EV 161-01-10]
3.18
emission limit (from a disturbing source)
specified maximum emission level of a source of electromagnetic disturbance
[1EV 161-03-12]
3.19
ground (reference) plane
flat conductive surface whose potential is used as a common reference
[1EV 161-04-36]
3.20
lead frame
supporting structure for the silicon die that interfaces the external pins to the die
3.21
measuring receiver
receiver for the measurement of disturbances with different detectors
NOTE The bandwidth of the receiver should be as specified in CISPR 16-1.
3.22
multi-chip module
MCM
integrated circuit whose elements are formed on or within two or more semiconductor chips that are mounted in a single package
3.23
multi IC sets
set of ICs that functions as a unit; in a higher level of integration the set could be a single IC
3.24
narrowband emission
emission which has a bandwidth less than that of a particular measuring apparatus or receiver
[1EV 161-06-13, modified].